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什么是堆积电介质（BU）膜？
积水化学绝缘增层膜应用参数
|
| NX04H | NQ07XP | Next Target |
|---|---|---|---|
| CTE (25-150°C) [ppm/°C] | 24.5 | 27 | 24 |
| CTE (150-240°C) [ppm/°C] | 70 | 94 | 82 |
| Dk (5.8GHz) | 3.3 | 3.3 | 3.3 |
| Df (5.8GHz) | 0.0090 | 0.0037 | 0.0023 |
| Tensile Strength [MPa] | 100 | 105 | 110 |
| Young’s Modulus [GPa] | 8 | 10 | 12 |
| Tg (DMA) [°C] | 205 | 183 | 183 |
| Elongation [%] | 2.4 | 2.6 | 2.6 |
| Ra (WYKO) [nm] | 50 | 50 | 50 |
| Available Thicknesses [μm] | > 20 | > 20 | > 20 |
| Flame Retardant (UL94) | V0 | V0 | ( V0 ※yet to be certified) |
| Applications | Package Substrates for CPU, Networking, PCIe Switch devices and more | ||
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